A close-up shot shows a microchip with gold traces and components on a dark background. A pointed instrument enters from the upper left, touching the chip with a thin, glowing fiber that traces lines across the surface.

A whole system on a single chip

Ultimate integration of components onto a single chip

Foundation

The Brilliance Platform

The core technology that builds the foundation of Brilliance's platform.

01

Silicon Nitride Photonics Platform

Our silicon nitride platform guides visible laser light with high efficiency while providing a scalable foundation for integrated photonic systems.

02

Integrated RGB Lasers

We integrate laser diodes directly onto the photonic chip, creating compact RGB laser sources with exceptional brightness and efficiency.

03

Wafer-Scale Manufacturing

We leverage standard wafer-scale manufacturing to produce integrated photonic chips with the scalability, consistency, and efficiency required for high-volume applications.

A close-up shot shows a photonic chip with glowing red, green, and blue light paths. A bundle of copper wires connects to the side of the circuit board.
Integration

Endless integration possibilities with building blocks

Custom solutions to optimize your application.

Laser Diodes

Integrated laser diodes on PIC platform

Brilliance integrates bare RGB laser diodes directly onto the PIC using a proprietary passive alignment process. This enables high coupling efficiency, compact packaging, and rapid assembly without active alignment, significantly reducing manufacturing complexity. Our platform supports a broad range of wavelengths including visible light and infrared.

>70% Coupling eff.
Wafer Scale assembly
SiN process

Highly scalable silicon-nitride PIC platform

The Brilliance platform is designed for high-volume manufacturing. By combining commercial silicon nitride processing with laser integration, the technology supports repeatable production and lower manufacturing costs.

<0.1dB/cm Propagation loss
200mm Wafer scale
RGB Full visible band
Beam shaping

Beam shaping

Integrated beam shaping allows precise control over the emitted laser beam. Output parameters such as numerical aperture, beam ellipticity, and beam quality can be tailored to match specific optical system requirements.

Uniformity > 90% Beam quality
0.05-0.30 Tunable NA
Tailored Illumination Profile
Multiple output options

Multiple output options

The beauty of an optical chip is that any waveguide structure can be defined by lithography. This means that we can make any output on our chip, such as pitch converters, combining light on the chip itself, or even define light exits on the surface. Optimizing the laserlight for your application enables seamless coupling to downstream optical components while minimizing optical losses.

On-chip No free-space optics
Despeckler

Despeckler

Integrated speckle reduction improves image quality by reducing laser speckle without adding bulky external components. The technology is fully integrated into the laserchip architecture.

<5% Speckle contrast
0 Moving parts
Metasurface

Metasurface

Combining our platform with integrated metasurfaces opens up an even bigger optical toolbox. Metasurfaces manipulate light directly on our chip surface, enabling advanced optical functions such as beam shaping and steering within an ultra-compact footprint.This reduces the number of discrete optical components even further, simplifying and shrinking your application.

From >6 to 1 Component reduction
Area Illumination

Area illumination

Area illuminators for uniform, wide-field RGB illumination in LCOS and other diverging beam applications. Transforms multiple RGB outputs into top-hat rectangular area illumination for LCOS display systems.

Homogeneous•Rectangular Area illumination

Despeckler

Kills coherent speckle on-chip for a smooth, uniform image.

Local dimming

Zone-level control for deeper blacks and higher dynamic range.

RGB splitters

Fan a single RGB output into multiple aligned channels.

Metasurface

Flat optic that shapes, splits or steers the beam in one layer.

Vertical Coupler

Extracts light from the chip into the target optical system.

Area Illuminator

Uniform, wide-field illumination

Why it matters

The path to unprecedented optical performance, robustness and scalability

One integrated platform delivers what discrete optics never could.

Brightness, efficiency, compact form factor and scale, at the same time.

A small electronic circuit board features an illuminated microchip on one end, with several gold-colored contact pads labeled D1, D2, and D3. The chip glows with vibrant blue, green, and red lights, casting a colorful reflection onto a nearby smooth…

Unprecedented performance

A close-up shot shows a microchip with gold traces and components on a dark background. A pointed instrument enters from the upper left, touching the chip with a thin, glowing fiber that traces lines across the surface.

Built-in robustness

A circular silicon wafer is illuminated against a black background, featuring numerous intricate microchips arranged in a grid pattern.

Semiconductor scalability

Endless integration possibilities

Building something different? Challenge us.

From standard configurations to fully customized integration, our silicon photonics platform is designed around your system requirements.